Product Releases

E.g., 2018-09-22
E.g., 2018-09-22
Headline Date
Microchip unveils next-generation In-Circuit Debugger (ICD) with unparalleled speed and flexibility
 Key Facts:MPLAB® ICD 4 features a faster processor and increased RAMAchieves up to twice the speed of the previous generation ICDOffers a wider voltage range of 1.20 to 5.5V and increased flexibilitySupports all PIC® MCUs and dsPIC®... MORE /
5 Oct 2017
A powerful NFC/HF Reader IC, the ST25R3911B offers 1.4 W output power combined with Automatic Antenna Tuning for the largest operating volume and read range even in challenging environments
 Able to drive differential or two single-ended antennas, it has enough power to externally multiplex an even greater amount. Combining capacitive and inductive low-power wakeup functions, it ensures fast response times while reducing power... MORE /
28 Sep 2017
Vishay Intertechnology RF MLCCs offer reliability and design flexibility with industry’s first operating temps to +200 °C in small cases
 Devices Provide High Q and Low ESR for Telecom Base Stations and Military Communication Systems Vishay Intertechnology Inc. (NYSE: VSH)  has introduced the industry’s first surface-mount multilayer ceramic chip capacitors (MLCCs)... MORE /
28 Sep 2017
New Vishay Intertechnology TMBS® Rectifiers in MicroSMP package save significant space while increasing power density and improving efficiency
 1 A and 2 A Devices Feature Low 0.65 mm Profile and Forward Voltage Drop Down to 0.36 V Vishay Intertechnology Inc. (NYSE: VSH) has recently expanded its offering of surface-mount TMBS® Trench MOS Barrier Schottky rectifiers with 10... MORE /
28 Sep 2017
Microchip unveils next-generation In-Circuit Debugger (ICD) with unparalleled speed and flexibility
 Microchip has announced the MPLAB® ICD 4, an in-circuit programming and debugging development tool for Microchip’s PIC® microcontroller and dsPIC® digital signal controller portfolios.  The MPLAB ICD 4 includes all the... MORE /
28 Sep 2017
Cypress Extends Scalability of Automotive MCU Portfolio with New Series for Secure, High-Speed Networking in Instrument Clusters and Body Applications
 New 40nm High-performance Traveo™ MCUs Support CAN FD Networking, eSHE Security and High-quality Sound, while Adding Graphics in Classic Cluster Applications. Cypress Semiconductor Corp. (NASDAQ: CY) has announced it is sampling new... MORE /
28 Sep 2017
Infineon introduces packaged MEMS microphones with a 70 dB signal-to-noise ratio
 Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is entering the packaged silicon microphone market. With this it is addressing the need for high performance, low noise MEMS microphones. The analogue and digital microphones are based on Infineon... MORE /
28 Sep 2017
Cypress Streamlines Wireless Design for Smart Home Applications with Addition of iCloud Support to IoT Development Platform
 Cypress Semiconductor Corp. (NASDAQ: CY), the leader in wireless connectivity solutions for the Internet of Things (IoT), has announced an updated version of its turnkey development platform for the IoT that simplifies the integration of wireless... MORE /
28 Sep 2017
Telit Introduces Ultra-slim, Smart Antenna GNSS Location Module
 SL876Q5-A module simplifies the development process and delivers superior performance for wearables, personal trackers, and other battery-dependent applications. Arrow Altech Distribution has announced the availability of a new, ultra-slim... MORE /
28 Sep 2017
Sierra Wireless announces industry’s first global dual-mode LPWA module with integrated application processing and GNSS
 AirPrime® WP Series now supports both LTE-M (Cat-M1) and NB-IoT (Cat-NB1) on a single CF3™ module to simplify design and deployment of innovative LPWA solutions Sierra Wireless (NASDAQ: SWIR) (TSX: SW), the leading provider of fully... MORE /
28 Sep 2017

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